Printed Circuit
Board Assembly

Precision Manufacturing


  • Early involvement with customer during design and development processes by participating in DFM / DFA
  • Support complete box build, sub-assembly and component assembly
  • 40 high speed SMT lines to support reflow soldering and wave soldering processes
  • Capable of 01005, 0201, BGA, CSP, LGA and Micro BGA
  • Products configured for ROHS processes
  • Support both High Mix Low Volume and Low Mix High Volume productions
  • Customized jigs and fixtures for consistency in assembly quality

Supply Chain Management


  • Work with world-wide suppliers and able to support quick turn support for prototyping build as well as mass production build
  • Actively participate in proposing alternative parts to customers to reduce cost during design stage
  • Continuously looking for new suppliers for better cost opportunities and technological capabilities to enhance our value-add services

Testing


In-circuit Test : Agilent test station for large volume mass production

Flying Probe : Applicable for High Mix Low Volume production and NPI build

Functional Test : Work with customer to develop test plans and testers for functional testing

Quality Assurance


We believe the highest performance in quality creates and sustains our clients’ brand recognition and excellence. This is achieved through our quality management system and programs such as Lean Six Sigma which played an integral part of instilling the culture of quality in our staff.

In-house Traceability System for PCBA Build:

  • Component Traceability System on PCBAs
  • Provide real time reports instantaneously

Certification/ Standards for Manufacturing and Validation :

  • QMS: ISO 13485
  • Risk Management: ISO 14971
  • Device Design Verification : ISO 20072
  • Batch Traceability System : In -house Shop-floor Management System
  • Electronics Assembly : IPC-A-610E

Other Certification includes :

  • ISO 13485
  • ISO 14001 : 2004 + Cor 1 : 2009
  • BS OHSAS 18001 : 2007
  • ISO 9001 : 2008

PCBA PROCESS

  1. Receiving & Kitting

  2. SMT Assembly

  3. Wave Solder

  4. Depanelize

  5. Testing

  6. Inspection

  7. Packing

  8. Finished Goods and Shipping

Locations Featuring PCBA

Product life cycle management - design, NPI, mass-production, EOL and service parts.

View All Locations
  • MALAYSIA, JOHOR, IPARK

  • MALAYSIA, KOTA TINGGI

  • CHINA, CHANGSHU

Want to talk?

Contact one of our Global sales locations.